MT40A1G8SA-075:E

Part Number: MT40A1G8SA-075:E

Hot Offer
Ball Grid Array (BGA) package with multiple solder balls on a flat microchip surface, designed for circuit board attachment.

Manufacturer

MICRON

Package

78-FBGA

Date Code

23+

Category

MICRON

Technical Specifications

Operating Temperature 0°C ~ 95°C (TC)
MSL 3 (168 Hours)
RoHS Status ROHS3 Compliant
ECCN EAR99

Product Details

IC DRAM 8GBIT PARALLEL 78FBGA

Applications

IC DRAM

Need Assistance?

Email

enquiry@nexcir.com

Response Time

Within 24 hours

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